Pulp and Paper
Pulp and Paper

Pulp and Paper

Beginning in 1995, VIM began a very long and mutually beneficial relationship with STI out of Waldron, AR (now Thermo Fisher Scientific). This relationship produced many DAS installations with a variety of major manufacturers of pulp and paper. VIM has maintained and nurtured these relationships over time and has helped navigate our pulp and paper partners through some of the most arduous regulatory demands including implementation of the NOx SIP Call.

Our latest product, CEMLink 6 is ideally suited for pulp and paper manufacturing environments, as the DAS can be individually located throughout the facility or centrally located, whatever the preference of the site is. Data can be shared with either scenario throughout the facility.

Latest News

EPA Administrator Signs Final Testing Provisions for Air Emission Sources Rule

March 16, 2023

On March 7, 2023, the EPA Administrator signed the final “Testing Provisions for Air Emission Sources” rule and submitted it for publication in the Federal Register.  A copy of unofficial internet version of the rule is available here.  The rule will become effective sixty (60) days after the date of publication in the Federal Register.  […]

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ECMPS 2.0 Re-Engineering

March 8, 2023

Did You Know? The Emission Collection and Monitoring Plan System (ECMPS) 2.0 web-based reporting platform is scheduled for mandatory reporting by Acid Rain Program, Cross-State Air Pollution Rule (CASPR), and Mercury Air Toxics Standards (MATS) Rule (Subpart UUUUU, 40 CFR Part 63) affected sources in 2024. More specifically, the Q1 2024 emissions and quality assurance […]

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EPIC Conference & Exhibit 2023

January 30, 2023

Energy, Progress, and Innovation Conference (EPIC) returned to Bismarck, North Dakota in January 2023. The EPIC Conference and Exhibit was held last week in Bismarck, ND with over 1000 participants from 30 states.   The conference brought together professionals from the energy, utilities, and the environment sectors.  VIM Technologies was proud to be in attendance to […]

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